High Speed Hot Bar Soldering Machine Bonding PCB And Fpc Board
Specification For Hot Bar Welding Machine YSPC-1A
1 . Establish year:1999
2 . lead time:5days
3 . working area:200*260mm
4 . fixture:1set
Specifications :
Microprocessor based controller provides precise and consistent temperature control .
Details :
Microprocessor based controller provides precise and consistent temperature control.
Unique pulsed heat thermos offers uniform temperature distribution, fast heating and cool-down.
Flexible programmable profiles for targeted idle, preheat and reflow heating.
Floating thermos and digital pressure switch ensure optimal pressure distribution across the joint
CCD camera system with magnification lens can be retrofitted for fine-pitch positing
Feature :
1 . Extremely short cycle time with rotary table design
2 . Product loading and unloading can be done during the heat sealing process
3 . High quality heat seal application up to 0.25mm pitch
4 . Pneumatic bonding head provide up to 3,900N force
5 . Digital programmable pressure control with LCD display
6 . Closed loop PID temperature control with visible LED display
7 . Bonding cycle is triggered by a real time pressure sensor
8 . Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
9. Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
10. Optional CCD alignment module with frame , camera , lens , monitor and illumination for fine pitch application
11. Full microprocessor logic control
Our Advantages :
1 . Engineer overseas tranning for customers
2 . Promise day technical support services
3 . Limit the handling of complaints , half an hour back to customers
4 . Reliable machine maker , we get Experts--15 , each one got over six years experience , equipment quality will be satisfying .
