1. On-line DIP dual side AOI for plug-in after soldering.
2.High inspection rate and low false alarm rate, automatically check color ring resistor, capacitor, diode, socket, etc..
3. Defect type:wrong part, missing part, reverse polarity and other defects of DIP element.
4.Spanning erection without change of production line.
5.Simplified programming flow, very simple interface. Support batch modifying parameters with one-key.
6.Centralized control. Interconnection between multiple equipment.
7.Real-time inspection without stopping the board.
8.Easy to move, adjustable height and width.
9.Locate defects quickly and can control production line.
10.PCBA dimensions: Maximum 400*300mm (12MP) / Maximum 520*380mm (31MP) Multiple selectable options.
11.Data is traceable. Support SPC alarm,LOG automatic collecting and storage function,NG warning/alarm function, Remote programming&debugging.
Advantage:
Deep Learning Algorithm
YS AOI by applying deep learning algorithm, big data optimization and intelligent minimalist programming in industrial inspection, YS enables intelligent judgment by one-click automatic identification of components and solder joints, thus addressing the two major pain points of traditional algorithms, namely, long programming time and high false alarm rate
Quick Inspection Speed
1.YS AOI Genetic algorithm path planning
2.Less number of FOV,Intelligently skip positions without welds. Reduce number of FOV and enhance efficiency
3.Photographing path is shorter. Reduce large-span FOV skipping to further save time.
4.More suitable imaging position,Avoid solder joint at FOV joint to guarantee test results.
5.GPU image parallel processing,Faster data running speed.
MES System Data Report
1.Camera automatically reads code (bar code and QR code).
2.Complete data, including overall statistic data and all inspection information of each board inspected.
3.Support one-key export, which is convenient for traceback. Data can be effectively applied in MES system.
Specification:
| Model | YS DIP On-line Dual side AOI AI-5146W (After THT Soldering) | YS DIP On-line Dual side AOI AI-5146WL (After THT Soldering) |
| FOV | 52.6*44mm |
| Resolution | 21.5um |
| Camera | 5M |
| Inspection Speed | 0.23sec/FOV |
| PCB Height | Top:75mm, Bottom:75mm |
| PCB Thickness | 0.3 ~ 6.0mm |
| PCB Edge | 3.0mm |
| PCB Warpage | ±3.0mm |
| PCB Weight | Max:10Kg |
| Conveyor Height | 750&900±20mm |
| With Adjustment | Manual&Auto |
| Conveyor Direction | L ~R or R ~L |
| Power | AC220 50/60Hz,5A |
| Rated power | 520W |
| Communication | SMEMA |
| Weight | 890Kg | 100Kg |
| Dimension | L1050*W1335*H1650mm | L1050*W1535*H1650mm |
